AI Training SuperServer SYS-822GA-NGR3

DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
DEMAND_SYS-822GA-NGR3
  • Form Factor 8U Rackmount
  • Supported CPUs AMD EPYC 9005
  • Intel Xeon 6900 P-cores
  • CPU Sockets 2
  • Max Supported Memory
    6 TB  DDR5  ECC Supported
  • Drive Bays 12 Hot swap 2.5" Drive Bays
  • Power Supply
    3000 W  Titanium  Redundant

Key Applications

  • Industrial Automation
  • Drug Discovery
  • Climate and Weather Modeling
  • Massive-scale AI Training
  • LLM & Multi-modal LLMs
  • Fraud Detection and Fintech

Key Features

  • Dual Intel® Xeon® 6900 series processors with P-cores
  • Support for up to 24 DIMMs DDR5-6400 and 8800 MT/s MRDIMMs
  • Support for 8 Gaudi® 3 OAM GPUs
  • 6 On-board OSFP 800GbE ports
  • Up to 2 PCIe 5.0 ×16 FHFL and 2 PCIe 5.0 ×8 FHFL slots
  • Default AIOM dual port 10GBase-T
  • Up to 8 × 2.5″ hot-swap NVMe Gen5 drive bays
  • 8 × 3000W (4+4) redundant Titanium level power supplies

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More Specifications

  • Configurable  Configurable by Request
  • Cores up to  128
  • TDP  500 W
  • M.2  2 NVMe M.2 slot
  • PCI-e  Default: 2 PCIe 5.0 x16 FHHL slots
  • Dimensions  13.8" (356 mm) Height
  • Dimensions  17.6" (447 mm) Width
  • Dimensions  33.2" (800 mm) Depth
  • Product Model  SYS-822GA-NGR3
  • LAN  6 OSFP 800GbE
  • NVMe  8 NVMe
  • USB  2 ports(rear)
  • Video Output  1 VGA
  • DIMM Type  MRDIMM
  • Chipset  System on Chip
  • On-board NVMe  NVMe
  • Operating Temperature  10°C ~ 35°C (50°F ~ 95°F)